H/W Solution Guide by Chipsets
LV-Tron is the leading innovator in commercial-use digital space infrastructure, focused on providing reliable, cutting-edge, and accessible visual communications since 2001. Our early focus on purpose-built hardware, open standards, and in-house firmware development yielded a diverse range of form-factors and use-cases across the landscape.
H/W Solution Guide by Chipsets
LV-Tron, a leader in commercial digital space infrastructure since 2001, delivers reliable, cutting-edge visual communications. With purpose-built hardware, open standards, and in-house firmware, we offer a wide range of chipsets for various form factors and use cases.
Featured Platforms
LV-Tron offers 5 chip manufacturers and 12 state-of-the-art chipset platforms for three focus applications to provide 10 solutions, including Smart office, Industrial automation and Life automation. They are planned differently according to the characteristics of the applications. LV-Tron engineering team would propose the right-fit solution to meet the requirements in carrying out the best cost/performance ratio among them, AI computing power is natively stand-by for being trigged anytime. Platforms and applications are matrixed in the table below.
Lifestyle
Smart Building
• Full codec for video streaming
• Wi-Fi / BT connectivity
• Camera & ISP
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- Edge AI
- Wi-Fi 6 connectivity
Enterprise
Smart Workplace
• Smart Working
• LTE / Wi-Fi connectivity
• Low power
• Security
• Android S/W support
- 5G / Wi-Fi 6 connectivity
Industrial IoT
HMI / Gateway / Edge AI
• Low Power extended temperature
• GbE / Wi-Fi connectivity
• Rich IO and expansion
• Camera & ISP, Edge AI
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- Vision AI
- Flexible Software
RK3588
Octa Core, Cortex-A76
RK3368
Quad Core, Cortex-A55
RK3566
Quad Core, Cortex-A55
RK3328
Quad Core, Cortex-A53
Genio 700
Octa Core, CA78 + CA55
Genio 500
Quad Core Cortex-A73
Genio 350
Quad Core Cortex-A53
i.MX8M Quad
Quad Core, Cortex-A55
i.MX8M Plus
Quad Core, Cortex-A55
i.MX8M Mini
Quad Core, Cortex-A53
Jetson NX2
Quad-core ARM A57 Complex
Jetson Nano
Quad-core ARM Cortex-A57
Elkhart Lake
Quad Core, Celeron
Rockchip
| Rockchip | RK3328 | RK3566 | RK3568 | RK3588 |
|---|---|---|---|---|
| Multicore Processing | Quad-core Cortex-A53 | Quad-core ARM Cortex-A55 | Quad-Core ARM Cortex-A55 | Quad-Core ARM Cortex-A76 + Quad-Core ARM Cortex-A55 |
| Machine Learning and Vision | - | 0.8TOPS NPU | 0.8 TOPS NPU | 6 TOPS NPU |
| GPU | Mali-450MP2 Support OpenGL ES 1.1 or 2.0, OpenVG 1.1 | ARM G52 2EE Support OpenGL ES 1.1/2.0/3.2 OpenCL 2.0 Vulkan 1.1 | ARM G52 2EE Support OpenGL ES 1.1/2.0/3.2 OpenCL 2.0 Vulkan 1.1 | ARM Mali-G610 MC4 |
| Display interfaces | HDMI 2.0a for 4K@60Hz with HDCP 1.4/2.2 | eDp/HDMI/MIPI/LVDS/EBC | RGB, LVDS or MIPI DSI, HDMI 2.0a, eDP 1.3, e-Ink; triple display support | Multiple display engine max to 8K Dual HDMI2.1/eDP V1.4 Combo interface Dual MIPI-DSI TX, 4 lances Dual DP v1.3 embed in USB 3.1,Audio, HDCP2.x |
| Video Playback | Video decode: 4K UHD H265/H264/VP9 Video encode: 1080p30 H.264/H.265 | Video decode: 4Kp60 H.264/H.265/VP9 Video encode: 1080p60 H.264/H.265 | Video decode: 4Kp60 H.264/H.265/VP9 Video encode: 1080p60 H.264/H.265 | Video decode: H.265/H.264/VP9/AV1/AVS2 video decoder, up to 8K@60fps Video encode: 8K@30fps for H.264/H.265 |
| Audio | 8 channels I2S/PDM interface, supports 8 channels Mic array | 8-channel I2S/TDM, 2x 2-channel I2S 8-channel PDM | 8-channel I2S/TDM, 2x 2-channel I2S 8-channel PDM S/PDIF out | 8-channel I2S0/I2S1 2-channel I2S2/I2S3 SPDIF0 / SPDIF1 8-channel PDM0/PDM1 |
| Camera Interfaces | 8bits BT656(PAL/NTSC) interface | 8M ISP | 8M ISP with HDR 4-lane / 2x 2-lane MIPI CSI2 @ 2.5 Gbps per lane 16-bit DVP camera support with BT.656/601/1120 | 2x MIPI CSI DPHY 4L/CPHY 3L 4x MIPI-CSI DPHY 2L |
| External Memory Interfaces | 32bit DDR3-1866/DDR3L-1866/LPDDR3-1866/DDR4-2133 | DDR3/DDR3L/DDR4 with ECC, LPDDR3/LPDDR4/LPDDR4X | DDR3/DDR3L/DDR4 with ECC, LPDDR3/LPDDR4/LPDDR4X | 64bit LPDDR4/LPDDR4x/LPDDR5 |
| USB | USB3.0/USB2.0 | 2x USB 2.0 host, USB 3.0/2.0 OTG, USB 3.0 host | 2x USB 2.0 host, USB 3.0/2.0 OTG, USB 3.0 host | 2x USB 3.1, 2x USB 2.0 OTG, 2x USB 2.0 host |
| PCIe | PCIe2.1 | PCIe2.1 | PCIe 2.1 1x1 lane PCIe 3.0 1x2 lane or 2x 1-lane @ 8 Gbps | PCIe 3.0, 4-lane or 2x 2-lane or 4x 1-lane |
| Ethernet | Supports 10/100/1000-Mbps data transfer rates with the RGMII interfaces | Gigabit Ethernet (GMAC) | 2x Gigabit Ethernet (GMAC) Quad serial gigabit media-independent interface (QSGMII)* | 2x Gigabit Ethernet |
| SDIO | SDIO 3.0 | SDIO 3.0 | SDIO 3.0 | SDIO 3.0 |
| CAN FD | - | - | 3x CAN FD | - |
| Operating Systems | Android | Android | Android | Android |
| Package | TFBGA395L(body: 14mm x 14mm;ball size:0.3mm;ball pitch:0.65mm) | FCCSP565L(body: 15.5mm x 14.4mm; ball size: 0.25mm; ball pitch: 0.65&0.4mm) | FCBGA636L (body: 19mm x 19mm; ball size: 0.3mm; ball pitch: 0.65mm) | FCBGA1088L(body: 23mm x 23mm; ball size: 0.36mm; ball pitch: 0.65mm) |
| Block Diagram |  |  |  |  |
MediaTek
| MediaTek | Genio 700 | Genio 500 | Genio 350 |
|---|---|---|---|
| CPU | 2X Arm Cortex-A78 (2.2GHz) 6X Arm Cortex-A55 (2.0 GHz) | Quad-core Arm Cortex-A73 | Quad-core Arm Cortex-A53 |
| GPU | Arm Mali-G57 MC3 | Arm Mali-G72 MP3 3D Graphics Accelerator (GPU) with Vulkan 1.0, OpenGL ES 3.2 and OpenCL 2.x full profile | Arm Mali-G52 MC1 3D Graphics Accelerator (GPU) with Vulkan 1.1, OpenGL ES 3.2 and OpenCL 2.0 full profile |
| AI Processor | MediaTek APU (MediaTek Deep Learning Accelerator) VP6 | Cadence Tensilica VP6 processor, 500 MHz | Cadence Tensilica VP6 processor, 700 MHz at 0.825 V |
| DSP | - | - | Single-core Cadence HiFi 4 Audio Engine |
| Memory | LPDDR3 and LPDDR4/X, EMI Up to 4GB | LPDDR3 and LPDDR4/X, EMI Up to 4GB | LPDDR3, DDR3/L, DDR4, and LPDDR4/X, EMI Up to 4GB |
| Storage | Memory Card Controller eMMC/SD/SDIO, MSDC0 eMMC (8-bit), MSDC1 Wi-Fi / SD Card (4-bit), UFS(one-lane) | Memory Card Controller eMMC/SD/SDIO, MSDC0 eMMC (8-bit), MSDC1 Wi-Fi / SD Card (4-bit), UFS(one-lane) | Memory Card Controller eMMC/SD/SDIO, MSDC0 eMMC (8-bit), MSDC1 Wi-Fi / SD Card (4-bit), MSDC2 Wi-Fi / SD Card (4-bit), NAND Flash Interface NFI |
| Display | Max Display Output Resolution 4K60 + FHD60 | Display Controller DISP Concurrent dual display, Display Parallel Interface DPI 12-bit, MIPI Display Bus Interface DSI Type B (8-/9-bit) or Type C (Option 1/3), MIPI Display Serial Interface DSI 4-lane. | Display Controller DISP Concurrent dual display, Display Parallel Interface DPI 24-bit, MIPI Display Serial Interface DSI 4-lane, Low Voltage Differential Signaling LVDS Single link (4-lane) |
| Imaging | ISP 32MP @ 30fps | Image Signal Processor ISP 32MP at 30fps, MIPI Camera Serial Interface 2 - CSI 3 x 4-lane D-PHY or 2 x 4-lane D-PHY and 3-trio C-PHY, or 2 x 2-lane D-PHY and 2 x 4-lane D-PHY | Image Signal Processor ISP 13MP at 30fps, Camera Parallel Interface CPI 10-bit, MIPI Camera Serial Interface CSI-2 CSI 2 4-lane, Face Detection 5.0 FD Yes, Warp Engine WPE, Sensor Interface SENINF |
| Video | Video Encoding HEVC, H.264 Max Recording Resolution Full HD, 4K30 Video Decoding AV1, VP9, HEVC, H.264 Max Playback Resolution 4K75 | Video Encoder VENC H.264, 1080p at 30fps, H.264/HEVC, 1080p at 30fps | Video Encoder VENC H.264, 1080p at 60fps, JPEG Encoder JPEG 15 quantization methods, Video Decoder VDEC H.264/HEVC, 1080p at 60fps |
| Audio | I2S0, I2S1, I | I2S0 ,I2S1,I2S2,I2S3,I2S5, PCM 2, PDM 1,TDM 8-channel TX | I2S0 ,I2S1,I2S2,I2S3,PCM, PDM, DMIC, TDM, S/PDIF, AFE |
| Connectivity | PCIe 2.0 USB 3.1 USB 2.0 OTG GbE MAC | I2C 9, UART 2, SPI 6, SSUSB SSUSB or USB 2.0 OTG, KeyPad 3x3, GPIO | I2C, UART, IRRX, SPI, USB2.0, EMAC, KeyPad, GPIO, PWM |
| Wireless Connectivity | MediaTek Wi-Fi 6 / Bluetooth 5.2 Combo MediaTek 5G | Wi-Fi, BT, GNSS, FMSYS | Wi-Fi, BT, GNSS, FMSYS |
| Block Diagram |  |  |  |
NXP
| NXP | i.MX 8M Quad | i.MX 8M Mini | i.MX 8M Plus |
|---|---|---|---|
| Multicore Processing | Quad Arm Cortex-A53; Cortex-M4F | 4x Cortex-A53 core platforms up to 1.8GHz per core 32KB L1-I Cache/ 32 kB L1-D Cache 512 kB L2 Cache 1x Cortex-M4 core up to 400MHz 16 kB L1-I Cache/ 16 kB L2-D Cache | 4x or 2x Cortex-A53 up to 1.8 GHz Cortex-M7 up to 800 MHz 32-bit DDR4 & LPDDR4 up to 4.0GT/s |
| Machine Learning and Vision | Neural Processing Unit (NPU): Delivers up to 2.3 TOPS Dual Image Signal Processor (ISPs): Resolution up to 12MP and input rate up to 375MPixels/s |
||
| GPU | OpenGLES 3.1, OpenGL3.0, Vulkan, Open CL1.2 | 3D GPU (1x shader, OpenGL ES 2.0) 2D GPU | 16 GFLOPS (high-precision) OpenGL ES 3.1/3.0, Vulkan, Open CL 1.2 FP, OpenVG 1.1 |
| Display interfaces | MIPI-DSI (4-lanes); HDMI 2.0a | 1x MIPI DSI (4-lane) with PHY | MIPI-DSI, HDMI 2.0a Tx, LVDS (4/8-lane) Tx |
| Video Playback | 4Kp60 with High Dynamic Range (h.265, VP9), 4Kp30 (h.264), 1080p60 (MPEG2, MPEG4p2, VC1, VP8, RV9, AVS/AVS+, h.263, DiVX), MJPEG - 8x8 | 1080p60 VP9 Profile 0, 2 (10-bit) decoder, HEVC/H.265 decoder, AVC/H.264 Baseline, Main, High decoder, VP8 decoder 1080p60 AVC/H.264 encoder, VP8 encoder | Video Decode: 1080p60, h.265/4, VP9, VP8 Video Encode: 1080p60, h.265/4 |
| Audio | 6x I2S/SAI (20+ channels, each 32-bits @384 kHz); S/PDIF Tx/Rx; DSD512 | 5x SAI (12Tx + 16Rx external I2S lanes), 8ch PDM input | 18x I2S TDM, DSD512, S/PDIF Tx + Rx, 8-ch PDM Mic input, eARC, ASRC Low power voice accelerator: Cadence Tensilica HiFi 4 DSP @ 800 MHz |
| Camera Interfaces | MIPI-CSI (4-lanes each) | 1x MIPI CSI (4-lane) with PHY | 2x MIPI CSI |
| External Memory Interfaces | LPDDR4, DDR4, DDR3L; Quad SPI with XIP | ||
| USB | Dual USB 3.0 Type C with PHY | 2x USB 2.0 OTG controllers with integrated PHY | 2x USB 3.0/2.0 Dual-Role with PHY type C |
| PCIe | Dual PCIe with L1 substates for fast wake-up from low-power mode | 1x PCIe 2.0 (1-lane) with L1 low power substates | PCIe Gen 3 |
| Ethernet | Gigabit Ethernet controller supporting AVB and EEE | 1x Gigabit Ethernet (MAC) with AVB and IEEE 1588, Energy Efficient Ethernet (EEE) for low power | 2x Gigabit Ethernet with AVB, IEEE 1588, EEE and 1x w/ TSN |
| SDIO | 3x SDIO 3.0 | ||
| CAN FD | 2x CAN FD | ||
| Operating Systems | Linux OS, Android?, Windows 10 IoT Core, FreeRTOS | Linux, Android, Windows 10 IoT Core, FreeRTOS | Linux, Android, FreeRTOS |
| Temperature | Consumer (0C to 95C); Industrial (-40C to 105C) | Consumer (0C to 95C) Industrial (-40C to 105C) | Consumer (0C to 95C) Industrial (-40C to 105C ) |
| Package | FCBGA, 0.65 mm pitch | FCBGA, 14x14 0.5mm pitch | FCBGA, 15x15 0.5 mm pitch |
| Block Diagram |  |  |  |
NVIDIA
| NVIDIA | Jetson Nano | Jetson TX2 NX |
|---|---|---|
| AI Performance | 0.5 TFLOPs (FP16) | 1.3 TFLOPS |
| GPU | NVIDIA Maxwell™ architecture with 128 NVIDIA CUDA® cores | NVIDIA Pascal™ Architecture GPU with 256 CUDA cores |
| CPU | Quad-core ARM® Cortex®-A57 MPCore processor | Dual-core NVIDIA Denver 2 64-bit CPU and quad-core ARM A57 Complex |
| DL Accelerator | - | - |
| Vision Accelerator | - | - |
| Memory | 4 GB 64-bit LPDDR4 | 4 GB 128-bit LPDDR4 |
| Storage | 16 GB eMMC 5.1 Flash | 16 GB eMMC 5.1 |
| Networking | 10/100/1000 BASE-T Ethernet | 10/100/1000 BASE-T Ethernet |
| Video Encode | 1x 4K60 2x 4K30 4x 1080p60 8x 1080p30 9x 720p30 (H.265 &H.264) | (H.265) 1x 4K60 3x 4K30 4x 1080p60 8x 1080p30 (H.264) 1x 4K60 3x 4K30 7x 1080p60 14x 1080p30 |
| Video Decode | 1x 4K60 2x 4K30 4x 1080p60 8x 1080p30 9x 720p60 (H.265 &H.264) | 2x 4K60 4x 4K30 7x 1080p60 14x 1080p30 (H.265 & H.264) |
| Camera | 12 lanes (3x4 or 4x2) MIPI CSI-2 D-PHY 1.1 (1.5 Gb/s per pair) | 12 lanes (3x4 or 5x2) MIPI CSI-2 D-PHY 1.2 (2.5 Gb/s per pair) |
| Wireless | Requires external solution | Requires external solution |
| Mechanical | 69.6 mm x 45mm 260-pin SO-DIMM edge connector | 69.6 mm x 45mm 260-pin SO-DIMM edge connector |
| Input Voltage | 5V (nominal) | 5V (nominal) |
| USB 2.0 | 3x | 3x |
| USB 3.x | 1x [3.0 GEN1] | 1x [3.0 GEN1] |
| PCIe | 1 x4[Gen2], Root Port only | 1 x1 + 1 x4 or 1 x2 + 2 x1[Gen2] Root Port only |
| Display | Two multi-mode DP 1.2a/eDP 1.4/ HDMI 2.0a/b | Two multi-mode DP 1.2a/eDP 1.4/ HDMI 2.0a/b, Twp 1x4 DS[1.5Gbps/lane] |
| Audio | 2x | 4x |
| SDIO/SD Card | 1x SD/SDIO | 1x SD/SDIO |
| Gigabit Ethernet | Supported | Supported |
| I2C | 4x | 4x |
| UART | 3x | 3x |
| SPI | 2x | 2x |
| CAN | Not supported | 1x |
| JTAG | Brought to on-module test points only | Not supported |
| Fan | PWM and Tach Input | PWM and Tach Input |
| Block Diagram |  |  |
Intel
| Intel | Elkhart Lake |
|---|---|
| CPU | Up to 4 Tremont Cores up to 3GHz |
| Package | Minimum Ball Pitch 0.593mm, Z-Height 1.464 to 2.502mm, TDP 4.5W-12W |
| GPU | Gen11 LP, LFM/HFM/Burst 200MHz /≤ 500MHz / ≤ 900MHz, Up to 32 Execution Units |
| Display | Gen11 3x Pipe, MIPI-DSI 1.2 @ 2.5Gbps, eDP 1.3 @ 5.4 Gbps, DP 1.4* @ 5.4 Gbps, HDMI 2.0b @ 5.94 Gbps, Max Resolution: 4K60x3 HDR |
| Media | HEVC/VP9 4K2K60FPS 420 8bit Codec HEVC/VP9 4K2K30FPS 444 8/10bit Codec |
| Memory | 4x32 LPDDR4/4x 4267MT/s Max 8GB / 4x32 LPDDR4/4x 3200MT/s Max 16GB / 2x64 DDR4 3200MT/s Max 32GB 4x32 LPDDR4/x (Memory Down) 2x64 DDR4 (SODIMM & Memory Down) |
| Audio | Quad Core Tensilica Diamond Extensa LX 6 core with HIFI 3 Audio Engine @ 400 MHz, 768KB L2 Cache / L2 SRAM, Speech Accelerator Speech Accelerator |
| USB | 4(2x dedicated port[1x Dual Role], 2x multiplexed with PCIe* 3.0) |
| PCIe* Gen3 | Up to 6 Ports, 8 Lanes (multiplexed with HSIO), Maximum Speed 8GT/s |
| SATA Gen3 | Maximum Configurable Ports 2, Maximum Speed 6Gb/s |
| Storage | eMMC 5.1 Maximum Speed 400MBps, Secure Digital: SD 3.01 SDIO 3.0, SD Speed: Default Mode: Up to 12.5 MBps/High Speed Mode: Up to 25 MBps/UHS-I Mode: Up to 100 MBps |
| Gigabit Ethernet | Controllers: 3 GbE with TSN (2 Controllers are accessible by Intel® PSE), Full Duplex @2500Mbps(SGMII), 1000Mbps(RGMII) Half and Full Duplex @ 10/100 Mbps |
| SIO | 3x SPI 25Mbps, 3x UART 3.8Mbps, 8x I2C 3.4Mbps |
| Block Diagram |  |
