A close-up of a chipset, symbolizing LV-Tron's hardware solution guide through its advanced chipsets.

H/W Solution Guide by Chipsets

LV-Tron is the leading innovator in commercial-use digital space infrastructure, focused on providing reliable, cutting-edge, and accessible visual communications since 2001. Our early focus on purpose-built hardware, open standards, and in-house firmware development yielded a diverse range of form-factors and use-cases across the landscape.

Featured Platforms

LV-Tron offers 5 chip manufacturers and 12 state-of-the-art chipset platforms for three focus applications to provide 10 solutions, including Smart office, Industrial automation and Life automation. They are planned differently according to the characteristics of the applications. LV-Tron engineering team would propose the right-fit solution to meet the requirements in carrying out the best cost/performance ratio among them, AI computing power is natively stand-by for being trigged anytime. Platforms and applications are matrixed in the table below.

Lifestyle

Smart Building

• Full codec for video streaming
• Wi-Fi / BT connectivity
• Camera & ISP


  • Edge AI
  • Wi-Fi 6 connectivity

Enterprise

Smart Workplace

• Smart Working
• LTE / Wi-Fi connectivity
• Low power
• Security
• Android S/W support

  • 5G / Wi-Fi 6 connectivity

Industrial IoT

HMI / Gateway / Edge AI

• Low Power extended temperature
GbE / Wi-Fi connectivity
Rich IO and expansion
Camera & ISP, Edge AI

  • Vision AI
  • Flexible Software
Rockchip Logo

RK3588
Octa Core, Cortex-A76

RK3368
Quad Core, Cortex-A55

RK3566
Quad Core, Cortex-A55

RK3328
Quad Core, Cortex-A53

MEDIATEK Logo

Genio 700
Octa Core, CA78 + CA55

Genio 500
Quad Core Cortex-A73

Genio 350
Quad Core Cortex-A53

NXP Logo

i.MX8M Quad
Quad Core, Cortex-A55

i.MX8M Plus
Quad Core, Cortex-A55

i.MX8M Mini
Quad Core, Cortex-A53

NVIDIA Logo

Jetson NX2
Quad-core ARM A57 Complex

Jetson Nano
Quad-core ARM Cortex-A57

Intel Logo

Elkhart Lake
Quad Core, Celeron

Rockchip

RockchipRK3328RK3566RK3568RK3588
Multicore ProcessingQuad-core Cortex-A53Quad-core ARM Cortex-A55Quad-Core ARM Cortex-A55Quad-Core ARM Cortex-A76 + Quad-Core ARM Cortex-A55
Machine Learning and Vision-0.8TOPS NPU0.8 TOPS NPU6 TOPS NPU
GPUMali-450MP2
Support OpenGL ES 1.1 or 2.0, OpenVG 1.1
ARM G52 2EE
Support OpenGL ES 1.1/2.0/3.2 OpenCL 2.0 Vulkan 1.1
ARM G52 2EE
Support OpenGL ES 1.1/2.0/3.2 OpenCL 2.0 Vulkan 1.1
ARM Mali-G610 MC4
Display interfacesHDMI 2.0a for 4K@60Hz with HDCP 1.4/2.2eDp/HDMI/MIPI/LVDS/EBCRGB, LVDS or MIPI DSI, HDMI 2.0a, eDP 1.3, e-Ink; triple display supportMultiple display engine max to 8K
Dual HDMI2.1/eDP V1.4 Combo interface
Dual MIPI-DSI TX, 4 lances
Dual DP v1.3 embed in USB 3.1,Audio, HDCP2.x
Video PlaybackVideo decode: 4K UHD H265/H264/VP9
Video encode: 1080p30 H.264/H.265
Video decode: 4Kp60 H.264/H.265/VP9
Video encode: 1080p60 H.264/H.265
Video decode: 4Kp60 H.264/H.265/VP9
Video encode: 1080p60 H.264/H.265
Video decode: H.265/H.264/VP9/AV1/AVS2 video decoder, up to 8K@60fps
Video encode: 8K@30fps for H.264/H.265
Audio8 channels I2S/PDM interface, supports 8 channels Mic array8-channel I2S/TDM, 2x 2-channel I2S
8-channel PDM
8-channel I2S/TDM, 2x 2-channel I2S
8-channel PDM
S/PDIF out
8-channel I2S0/I2S1
2-channel I2S2/I2S3
SPDIF0 / SPDIF1
8-channel PDM0/PDM1
Camera Interfaces8bits BT656(PAL/NTSC) interface8M ISP8M ISP with HDR
4-lane / 2x 2-lane MIPI CSI2 @ 2.5 Gbps per lane
16-bit DVP camera support with BT.656/601/1120
2x MIPI CSI DPHY 4L/CPHY 3L
4x MIPI-CSI DPHY 2L
External Memory Interfaces32bit DDR3-1866/DDR3L-1866/LPDDR3-1866/DDR4-2133DDR3/DDR3L/DDR4 with ECC, LPDDR3/LPDDR4/LPDDR4XDDR3/DDR3L/DDR4 with ECC, LPDDR3/LPDDR4/LPDDR4X64bit LPDDR4/LPDDR4x/LPDDR5
USBUSB3.0/USB2.02x USB 2.0 host, USB 3.0/2.0 OTG, USB 3.0 host2x USB 2.0 host, USB 3.0/2.0 OTG, USB 3.0 host2x USB 3.1, 2x USB 2.0 OTG, 2x USB 2.0 host
PCIePCIe2.1PCIe2.1PCIe 2.1 1x1 lane
PCIe 3.0 1x2 lane or 2x 1-lane @ 8 Gbps
PCIe 3.0, 4-lane or 2x 2-lane or 4x 1-lane
EthernetSupports 10/100/1000-Mbps data transfer rates with the RGMII interfacesGigabit Ethernet (GMAC)2x Gigabit Ethernet (GMAC)
Quad serial gigabit media-independent interface (QSGMII)*
2x Gigabit Ethernet
SDIOSDIO 3.0SDIO 3.0SDIO 3.0SDIO 3.0
CAN FD--3x CAN FD-
Operating SystemsAndroidAndroidAndroidAndroid
PackageTFBGA395L(body: 14mm x 14mm;ball size:0.3mm;ball pitch:0.65mm)FCCSP565L(body: 15.5mm x 14.4mm; ball size: 0.25mm; ball pitch: 0.65&0.4mm)FCBGA636L (body: 19mm x 19mm; ball size: 0.3mm; ball pitch: 0.65mm)FCBGA1088L(body: 23mm x 23mm; ball size: 0.36mm; ball pitch: 0.65mm)
Block Diagram

MediaTek

MediaTekGenio 700Genio 500 Genio 350
CPU2X Arm Cortex-A78 (2.2GHz)
6X Arm Cortex-A55 (2.0 GHz)
Quad-core Arm Cortex-A73Quad-core Arm Cortex-A53
GPUArm Mali-G57 MC3Arm Mali-G72 MP3 3D Graphics Accelerator (GPU) with
Vulkan 1.0, OpenGL ES 3.2 and OpenCL 2.x full profile
Arm Mali-G52 MC1 3D Graphics Accelerator (GPU) with
Vulkan 1.1, OpenGL ES 3.2 and OpenCL 2.0 full profile
AI ProcessorMediaTek APU (MediaTek Deep Learning Accelerator)
VP6
Cadence Tensilica VP6 processor, 500 MHzCadence Tensilica VP6 processor, 700 MHz at 0.825 V
DSP--Single-core Cadence HiFi 4 Audio Engine
MemoryLPDDR3 and LPDDR4/X, EMI Up to 4GBLPDDR3 and LPDDR4/X, EMI Up to 4GB LPDDR3, DDR3/L, DDR4, and LPDDR4/X, EMI Up to 4GB
StorageMemory Card Controller eMMC/SD/SDIO, MSDC0 eMMC (8-bit), MSDC1 Wi-Fi / SD Card (4-bit), UFS(one-lane)Memory Card Controller eMMC/SD/SDIO, MSDC0 eMMC (8-bit), MSDC1 Wi-Fi / SD Card (4-bit), UFS(one-lane)Memory Card Controller eMMC/SD/SDIO, MSDC0 eMMC (8-bit), MSDC1 Wi-Fi / SD Card (4-bit), MSDC2 Wi-Fi / SD Card (4-bit), NAND Flash Interface NFI
DisplayMax Display Output Resolution 4K60 + FHD60Display Controller DISP Concurrent dual display, Display Parallel Interface DPI 12-bit, MIPI Display Bus Interface DSI Type B (8-/9-bit) or Type C (Option 1/3), MIPI Display Serial Interface DSI 4-lane.Display Controller DISP Concurrent dual display, Display Parallel Interface DPI 24-bit, MIPI Display Serial Interface DSI 4-lane, Low Voltage Differential Signaling LVDS Single link (4-lane)
ImagingISP 32MP @ 30fpsImage Signal Processor ISP 32MP at 30fps, MIPI Camera Serial Interface 2 - CSI 3 x 4-lane D-PHY or 2 x 4-lane D-PHY and 3-trio C-PHY, or 2 x 2-lane D-PHY and 2 x 4-lane D-PHY Image Signal Processor ISP 13MP at 30fps, Camera Parallel Interface CPI 10-bit, MIPI Camera Serial Interface CSI-2 CSI 2 4-lane, Face Detection 5.0 FD Yes, Warp Engine WPE, Sensor Interface SENINF
VideoVideo Encoding HEVC, H.264 Max Recording Resolution Full HD, 4K30 Video Decoding AV1, VP9, HEVC, H.264 Max Playback Resolution 4K75Video Encoder VENC H.264, 1080p at 30fps, H.264/HEVC, 1080p at 30fpsVideo Encoder VENC H.264, 1080p at 60fps, JPEG Encoder JPEG 15 quantization methods, Video Decoder VDEC H.264/HEVC, 1080p at 60fps
AudioI2S0, I2S1, II2S0 ,I2S1,I2S2,I2S3,I2S5, PCM 2, PDM 1,TDM 8-channel TXI2S0 ,I2S1,I2S2,I2S3,PCM, PDM, DMIC, TDM, S/PDIF, AFE
ConnectivityPCIe 2.0
USB 3.1
USB 2.0 OTG
GbE MAC
I2C 9, UART 2, SPI 6, SSUSB SSUSB or USB 2.0 OTG, KeyPad 3x3, GPIOI2C, UART, IRRX, SPI, USB2.0, EMAC, KeyPad, GPIO, PWM
Wireless ConnectivityMediaTek Wi-Fi 6 / Bluetooth 5.2 Combo
MediaTek 5G
Wi-Fi, BT, GNSS, FMSYSWi-Fi, BT, GNSS, FMSYS
Block Diagram

NXP

NXPi.MX 8M Quadi.MX 8M Minii.MX 8M Plus
Multicore ProcessingQuad Arm Cortex-A53; Cortex-M4F4x Cortex-A53 core platforms up to 1.8GHz per core
32KB L1-I Cache/ 32 kB L1-D Cache
512 kB L2 Cache
1x Cortex-M4 core up to 400MHz
16 kB L1-I Cache/ 16 kB L2-D Cache
4x or 2x Cortex-A53 up to 1.8 GHz
Cortex-M7 up to 800 MHz
32-bit DDR4 & LPDDR4 up to 4.0GT/s
Machine Learning and VisionNeural Processing Unit (NPU): Delivers up to 2.3 TOPS
Dual Image Signal Processor (ISPs): Resolution up to 12MP and input rate up to 375MPixels/s
GPUOpenGLES 3.1, OpenGL3.0, Vulkan, Open CL1.23D GPU (1x shader, OpenGL ES 2.0)
2D GPU
16 GFLOPS (high-precision) OpenGL ES 3.1/3.0, Vulkan, Open CL 1.2 FP, OpenVG 1.1
Display interfacesMIPI-DSI (4-lanes); HDMI 2.0a1x MIPI DSI (4-lane) with PHYMIPI-DSI, HDMI 2.0a Tx, LVDS (4/8-lane) Tx
Video Playback4Kp60 with High Dynamic Range (h.265, VP9), 4Kp30 (h.264), 1080p60 (MPEG2, MPEG4p2, VC1, VP8, RV9, AVS/AVS+, h.263, DiVX), MJPEG - 8x81080p60 VP9 Profile 0, 2 (10-bit) decoder, HEVC/H.265 decoder, AVC/H.264 Baseline, Main, High decoder, VP8 decoder
1080p60 AVC/H.264 encoder, VP8 encoder
Video Decode: 1080p60, h.265/4, VP9, VP8
Video Encode: 1080p60, h.265/4
Audio6x I2S/SAI (20+ channels, each 32-bits @384 kHz); S/PDIF Tx/Rx; DSD5125x SAI (12Tx + 16Rx external I2S lanes), 8ch PDM input18x I2S TDM, DSD512, S/PDIF Tx + Rx, 8-ch PDM Mic input, eARC, ASRC
Low power voice accelerator: Cadence Tensilica HiFi 4 DSP @ 800 MHz
Camera InterfacesMIPI-CSI (4-lanes each)1x MIPI CSI (4-lane) with PHY2x MIPI CSI
External Memory InterfacesLPDDR4, DDR4, DDR3L; Quad SPI with XIP
USBDual USB 3.0 Type C with PHY2x USB 2.0 OTG controllers with integrated PHY2x USB 3.0/2.0 Dual-Role with PHY type C
PCIeDual PCIe with L1 substates for fast wake-up from low-power mode1x PCIe 2.0 (1-lane) with L1 low power substatesPCIe Gen 3
EthernetGigabit Ethernet controller supporting AVB and EEE1x Gigabit Ethernet (MAC) with AVB and IEEE 1588, Energy Efficient Ethernet (EEE) for low power2x Gigabit Ethernet with AVB, IEEE 1588, EEE and 1x w/ TSN
SDIO3x SDIO 3.0
CAN FD2x CAN FD
Operating SystemsLinux OS, Android?, Windows 10 IoT Core, FreeRTOSLinux, Android, Windows 10 IoT Core, FreeRTOSLinux, Android, FreeRTOS
TemperatureConsumer (0C to 95C); Industrial (-40C to 105C)Consumer (0C to 95C)
Industrial (-40C to 105C)
Consumer (0C to 95C)
Industrial (-40C to 105C )
PackageFCBGA, 0.65 mm pitchFCBGA, 14x14 0.5mm pitchFCBGA, 15x15 0.5 mm pitch
Block Diagram

NVIDIA

NVIDIAJetson NanoJetson TX2 NX
AI Performance0.5 TFLOPs (FP16)1.3 TFLOPS
GPUNVIDIA Maxwell™ architecture with 128 NVIDIA CUDA® coresNVIDIA Pascal™ Architecture GPU with 256 CUDA cores
CPUQuad-core ARM® Cortex®-A57 MPCore processorDual-core NVIDIA Denver 2 64-bit CPU and quad-core ARM A57 Complex
DL Accelerator--
Vision Accelerator--
Memory4 GB 64-bit LPDDR44 GB 128-bit LPDDR4
Storage16 GB eMMC 5.1 Flash16 GB eMMC 5.1
Networking10/100/1000 BASE-T Ethernet10/100/1000 BASE-T Ethernet
Video Encode1x 4K60
2x 4K30
4x 1080p60
8x 1080p30
9x 720p30
(H.265 &H.264)
(H.265)
1x 4K60
3x 4K30
4x 1080p60
8x 1080p30

(H.264)
1x 4K60
3x 4K30
7x 1080p60
14x 1080p30
Video Decode1x 4K60
2x 4K30
4x 1080p60
8x 1080p30
9x 720p60
(H.265 &H.264)
2x 4K60
4x 4K30
7x 1080p60
14x 1080p30
(H.265 & H.264)
Camera12 lanes (3x4 or 4x2) MIPI CSI-2
D-PHY 1.1 (1.5 Gb/s per pair)
12 lanes (3x4 or 5x2) MIPI CSI-2
D-PHY 1.2 (2.5 Gb/s per pair)
WirelessRequires external solutionRequires external solution
Mechanical69.6 mm x 45mm 260-pin SO-DIMM edge connector69.6 mm x 45mm 260-pin SO-DIMM edge connector
Input Voltage5V (nominal)5V (nominal)
USB 2.03x3x
USB 3.x1x [3.0 GEN1]1x [3.0 GEN1]
PCIe1 x4[Gen2], Root Port only1 x1 + 1 x4 or 1 x2 + 2 x1[Gen2] Root Port only
DisplayTwo multi-mode DP 1.2a/eDP 1.4/ HDMI 2.0a/bTwo multi-mode DP 1.2a/eDP 1.4/ HDMI 2.0a/b, Twp 1x4 DS[1.5Gbps/lane]
Audio2x4x
SDIO/SD Card1x SD/SDIO1x SD/SDIO
Gigabit Ethernet SupportedSupported
I2C4x4x
UART3x3x
SPI2x2x
CANNot supported1x
JTAGBrought to on-module test points onlyNot supported
FanPWM and Tach InputPWM and Tach Input
Block Diagram

Intel

IntelElkhart Lake
CPUUp to 4 Tremont Cores up to 3GHz
PackageMinimum Ball Pitch 0.593mm, Z-Height 1.464 to 2.502mm, TDP 4.5W-12W
GPUGen11 LP, LFM/HFM/Burst 200MHz /≤ 500MHz / ≤ 900MHz, Up to 32 Execution Units
DisplayGen11 3x Pipe, MIPI-DSI 1.2 @ 2.5Gbps, eDP 1.3 @ 5.4 Gbps, DP 1.4* @ 5.4 Gbps, HDMI 2.0b @ 5.94 Gbps, Max Resolution: 4K60x3 HDR
MediaHEVC/VP9 4K2K60FPS 420 8bit Codec
HEVC/VP9 4K2K30FPS 444 8/10bit Codec
Memory4x32 LPDDR4/4x 4267MT/s Max 8GB / 4x32 LPDDR4/4x 3200MT/s Max 16GB / 2x64 DDR4 3200MT/s Max 32GB
4x32 LPDDR4/x (Memory Down) 2x64 DDR4 (SODIMM & Memory Down)
AudioQuad Core Tensilica Diamond Extensa LX 6 core with HIFI 3 Audio Engine @ 400 MHz, 768KB L2 Cache / L2 SRAM, Speech Accelerator Speech Accelerator
USB4(2x dedicated port[1x Dual Role], 2x multiplexed with PCIe* 3.0)
PCIe* Gen3Up to 6 Ports, 8 Lanes (multiplexed with HSIO), Maximum Speed 8GT/s
SATA Gen3Maximum Configurable Ports 2, Maximum Speed 6Gb/s
StorageeMMC 5.1 Maximum Speed 400MBps, Secure Digital: SD 3.01 SDIO 3.0, SD Speed: Default Mode: Up to 12.5 MBps/High Speed Mode: Up to 25 MBps/UHS-I Mode: Up to 100 MBps
Gigabit EthernetControllers: 3 GbE with TSN (2 Controllers are accessible by Intel® PSE), Full Duplex @2500Mbps(SGMII), 1000Mbps(RGMII) Half and Full Duplex @ 10/100 Mbps
SIO3x SPI 25Mbps, 3x UART 3.8Mbps, 8x I2C 3.4Mbps
Block Diagram

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