The LVB-8390-R1 is a powerful System on Module (SoM) built with MediaTek Genio 700 MT8390, featuring a combination of dual Cortex-A78 and six Cortex-A55 cores for optimized performance and energy efficiency. Delivering 4 TOPS AI computing power, it’s ideal for AI edge devices, smart home applications, and IoT solutions. With support for up to 8GB LPDDR4X memory and up to 64GB eMMC storage, it provides flexibility for various workloads. Optional Wi-Fi 6 and Bluetooth 5.2 connectivity via the MT7921 module enhances wireless communication. The 316-pin LCC package allows for seamless integration in embedded systems requiring high processing power and efficient design.
LVB-8390-R1
ARM SoM, 316 Pins LCC SMT Type, MT8390
- MediaTek Genio 700 MT8390 (A78 x2 + A55 x6)
- 4 TOPS Performance
- 2GB / 4GB / 8GB LPDDR4X
- 16GB / 32GB / 64GB eMMC
- MT7921:
Wi-Fi 6 2T2R + BT 5.2 (Optional) - 316 Pins LCC
Technical Specifications
| Model | LVB-8390-R1 |
|---|---|
| Operating System | Yocto Linux / Ubuntu / Android 13 |
| CPU | MediaTek Genio 700 MT8390 (A78 x2 + A55 x6) |
| GPU | Mali-G57 |
| APU Performance | 4 TOPS |
| Memory | 2GB / 4GB / 8GB LPDDR4X |
| Storage | 16GB / 32GB / 64GB eMMC |
| Pin Out | 316 Pins LCC |
| Display | MIPI-DSI, MIPI-CSI, EDP, DP, HDMI |
| USB | USB 3.0, USB 2.0 |
| Ethernet | 10 / 100 / 1000 Mbps |
| Audio | 2 In, 2 Out |
| Wireless Connectivity | MT7921: Wi-Fi 6 2T2R + BT 5.2 (Optional) |
| Operation Temperature Range | -20°C ~ 65°C |
| Operation Humidity Range | 0% ~ 90% RH non-condensing |
| Power | DC 4.2V / 3A |
| Product Dimensions | 68 x 51 mm |